Exchange of SMD and THT components.
Hand soldering of SMT + THT component samples and small-scale batches.
Cleaning of components for protection against corrosion-induced interruption, signal distortion, leakage current, and electrochemical migration.
The cleaning process is adapted to meet board requirements.
It is possible to repair gold contacts / gold surfaces on boards exhibiting solder spatter or wear.
To do this, we have developed a thermal procedure which allows the complete removal of solder on gold contacts without deforming the nickel layer.
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As a competent service provider, we are on hand at all times to help with the above-mentioned specialist fields. We look at these points and more detailed special requests and respond to them immediately.