• It is possible to repair gold contacts / gold surfaces on boards exhibiting solder spatter or wear.

  • To do this, we have developed a thermal procedure which allows the complete removal of solder on gold contacts without deforming the nickel layer (striae). The gold is then re-applied electrolytically. The repair is IPC-compliant.

  • Board rework
    • Wire wrap with connection from top to bottom
    • PCB holes
    • PCB re-build (change revision status)

  • PCB repair
    • Component exchange in the event of incorrect population
    • Component exchange in the event of damage